System 3000 and System 3000C have been developed as System Dispensers that are designed for controlling various fluid by the world highest technologies featured with the following functions;

• Dispense positioning calibration by means of image processing
• Work height calibration by means of displacement sensor
• Bad-mark detection by means of image processing
• Heating functions
• IEI original personal computer robot (MGC-PC), designed to edit the original programs simply by WindowsNT, is standardised. In addition, various optional devices can be organized for the most suitable system for dispensing, which meet various application requirements.

[APPLICATIONS]
Under-filling flip chip COB encapsulation Micro dotting of conductive adhesive
 
 
 

Fully automated pressure compensation helps to eliminate a common problem of continuously decreasing shot volumes while dispensing. ACCURA 9, a patented technology, are integrated in various automation devices such as die bonding machines, underfilling machines and SMT processes.

 
 
 

Customized to suite the requirements of speed, stroke, accuracy of dispensing patterns. Dispensing accuracy can be achieved by integrating the latest technology of pressure compensation system dispenser ACCURA9 (Patented). The picture shown is standard work area of PCB bond dispensing of 330mm x 250mm effective stroke. Optional features are available upon request.

 
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